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Home / Food Processing Machine / POTATO WAFER MACHINE / POTATO WAFER MACHINE (SLICER) (WITH 3 DIE)
POTATO WAFER MACHINE

POTATO WAFER MACHINE (SLICER) (WITH 3 DIE)

POTATO WAFER MACHINE (SLICER) (WITH 3 DIE)

Technical Specifications

Specification Parameter Value
[{Specification Parameter:MOTOR Value:0.5HP 1440RPM}

Related Processes

Cutting & Slicing
CUTTING & SLICING
Frying
FRYING

Related Applications

Chips
CHIPS